Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-08-28
2007-08-28
Nasri, Javaid H. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
11489421
ABSTRACT:
According to an embodiment of the present invention, a method for attaching a cable (30) to a circuit substrate (20) includes the steps of: (a) providing a circuit substrate having a number of conductive pads (202) arranged thereon in matrix; (b) providing a cable having a number of conductive balls (302) attached thereto in compliance with the conductive pads of the circuit substrate; and (c) securing the cable to the circuit substrate with the conductive balls thereof being securely and electrically registered with the corresponding conductive pads of the circuit substrate, respectively.
REFERENCES:
patent: 5009605 (1991-04-01), Crumly et al.
patent: 6045368 (2000-04-01), Cadenhead et al.
patent: 6280205 (2001-08-01), Murowaki et al.
patent: 6783371 (2004-08-01), Self et al.
patent: 7094067 (2006-08-01), Kitagawa
Hsu Hsiu-Yuan
Polnyi Igor
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Nasri Javaid H.
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