Method for attaching a removable tape to encapsulate a semicondu

Details Method for attaching a removable tape to encapsulate a semicondu Method for attaching a removable tape to encapsulate a semicondu

1997-07-17

2000-03-07

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438110, 438111, 438124, 438126, 438127, H01L 2156

Patent

active

060339330

ABSTRACT:
A method for fabricating a semiconductor package having a semiconductor chip and leads attached to the chip includes the steps of placing a tape over the leads attached to the semiconductor chip, forming a mold to encapsulate the semiconductor chip and the leads while exposing a portion of the leads contacting the tape, and removing the tape over the leads after the mold forming step.

REFERENCES:
patent: 5134773 (1992-08-01), LeMaire et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5366933 (1994-11-01), Golwalkar et al.
patent: 5450283 (1995-09-01), Lin et al.
patent: 5474958 (1995-12-01), Djennas et al.

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