Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-10-31
1998-03-24
Vo, Peter
Metal working
Method of mechanical manufacture
Electrical device making
29836, 29841, 22818022, 257772, 257737, 174260, H05K 334, H05K 1304
Patent
active
057298963
ABSTRACT:
A structure and method is disclosed for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability. IC chips with a new solder interconnect structure, comprised of a layer of pure tin, deposited on the top of high melting Pb--Sn solder balls are employed for joining. These methods, techniques and metallurgical structures enables direct attachment of electronic devices of any complexity to any substrate and to any level of packaging hierarchy. Also, devices or packages having other joining technologies, eg. SMT, BGA, TBGA, etc. could be joined onto the flexible circuit carrier.
REFERENCES:
patent: 4967950 (1990-11-01), Legg et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5130779 (1992-07-01), Agarwala et al.
patent: 5238176 (1993-08-01), Nishimura
patent: 5251806 (1993-10-01), Agarwala et al.
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5297333 (1994-03-01), Kusaka
patent: 5384952 (1995-01-01), Matsui
patent: 5435732 (1995-07-01), Angulus et al.
patent: 5478420 (1995-12-01), Gauci et al.
patent: 5489750 (1996-02-01), Sakemi et al.
patent: 5615477 (1997-04-01), Sweitzer
patent: 5634268 (1997-06-01), Dalal et al.
Dawson, et al., "Indium-Lead-Indium Chip Joining", IBM Technical Disclosure Bulletin, vol. 11, No. 11, Apr. 1969, p. 528.
Microelectronics Packaging Handbook, edited by Rao R. Tummala and Eugene J. Rymaszewski, pp. 366-391 (1989).
Milkovich et al., "Double Sided Flexible Carrier with Discretes and Thermally Enhanced FCA/COF", IEEE 43rd ECTC Proceedings, Jun. 1993, pp. 16-21.
Milkovich et al., U.S. Patent Application Serial No. 08/071,630, entitled "Manufacturing Flexible Circuit Board Assemblies with Common Heat Spreaders", filed on Jun. 3, 1993.
Fallon et al., U.S. Patent Application Serial No. 08/387,686, entitled "Process for Selective Application of Solder to Circuit Packages", filed on Feb. 13, 1995, now U.S. Patent No. 5,597,469.
Dalal Hormazdyar M.
Fallon Kenneth M.
Gaudenzi Gene J.
Milkovich Cynthia S.
Ahsan Aziz M.
International Business Machines - Corporation
Vo Peter
LandOfFree
Method for attaching a flip chip on flexible circuit carrier usi does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for attaching a flip chip on flexible circuit carrier usi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for attaching a flip chip on flexible circuit carrier usi will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2280546