Method for assessing fit and alignment of a manufactured part

Image analysis – Applications – Manufacturing or product inspection

Reexamination Certificate

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Details

C382S154000, C382S285000, C348S042000, C348S051000

Reexamination Certificate

active

07024032

ABSTRACT:
An automated method is provided for assessing fit and alignment of an assembly component in relation to its assembly environment. The method includes: collecting measurement data for the assembly component; defining model data representative of an assembly environment, where the assembly environment is defined by surfaces of objects that are adjacent to the assembly component in an assembled configuration; and comparing the measurement data with the model data for the assembly environment, thereby assessing the assembly component in relation to its assembly environment.

REFERENCES:
patent: 4639878 (1987-01-01), Day et al.
patent: 5125298 (1992-06-01), Smith
patent: 5340174 (1994-08-01), Bender et al.
patent: 5706325 (1998-01-01), Hu
patent: 5829114 (1998-11-01), Kleefeldt
patent: 5881780 (1999-03-01), Matye et al.
patent: 6166811 (2000-12-01), Long et al.
patent: 6473978 (2002-11-01), Maas

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