Method for assembling testing equipment for semiconductor...

Details Method for assembling testing equipment for semiconductor... Method for assembling testing equipment for semiconductor...

2011-03-22

2011-03-22

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S874000, C029S846000

Reexamination Certificate

active

07908747

ABSTRACT:
Upon an assembly of a probe head unit, the relative positions of the probe pins28aito those of the electrode group24E in the pitch-changing substrate24are determined by making the positions of the through-holes26A,26B,26C and26D in the contact block26to coincide with the positioning marks24MA,24MB,24MC and24MD in the pitch-changing substrate24.

REFERENCES:
patent: 3873429 (1975-03-01), Brown
patent: 5789930 (1998-08-01), Isaacs et al.
patent: 6015520 (2000-01-01), Appelt et al.
patent: 6133072 (2000-10-01), Fjelstad
patent: 6835318 (2004-12-01), Suzuki et al.
patent: 2002/0029486 (2002-03-01), Uchiyama et al.
patent: 2002/0118029 (2002-08-01), Yamasaka
patent: 03-192741 (1991-08-01), None
patent: 04-249333 (1992-09-01), None
patent: 05-267802 (1993-10-01), None
patent: 08125396 (1994-10-01), None
patent: 07-211750 (1995-08-01), None
patent: 08-125396 (1996-05-01), None
patent: H08-125396 (1996-05-01), None
patent: 10-065291 (1998-03-01), None
patent: 10-270815 (1998-10-01), None
patent: 11-004082 (1999-01-01), None
patent: 11-142435 (1999-05-01), None
patent: 2000-165047 (2000-06-01), None
patent: 2000-188483 (2000-07-01), None
patent: 2001-034324 (2001-02-01), None
patent: 97-032310 (1997-06-01), None

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