Method for assembling packages of semi-conductor elements

Details Method for assembling packages of semi-conductor elements Method for assembling packages of semi-conductor elements

1991-11-06

1993-04-06

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437217, 174 524, H01L 2160

Patent

active

052003671

ABSTRACT:
A method for assembling multilayer packages of semi-conductor elements comprising double molding of the multilayer structure. The method comprises the steps of primarily molding inner leads of a lead frame, secondarily molding the inner leads to form a desired package, and performing in turn die bonding, wire bonding, trimming and forming processes. The double molding process is performed by using an inexpensive molding compound, thereby obtaining packages having a structure equivalent to that of expensive ceramic packages. Accordingly, the manufacture cost of packages is inexpensive and the assembling process is simplified.

REFERENCES:
patent: 4172261 (1979-10-01), Tsuzuki et al.
patent: 4663833 (1987-05-01), Tanaka et al.
patent: 4761518 (1988-08-01), Butt et al.
patent: 4769344 (1988-09-01), Sakai et al.
patent: 4812420 (1989-03-01), Matsuda et al.
patent: 4827082 (1989-05-01), Horiuchi et al.
patent: 4833102 (1989-05-01), Byrne et al.
patent: 4857483 (1989-08-01), Steffen et al.
patent: 4903119 (1990-02-01), Ito et al.
patent: 4971930 (1990-11-01), Fusaroli et al.
patent: 4994411 (1991-02-01), Naito et al.
Tummala, et al., Microelectronics Packaging Handbook, "Plastic Packaging Process," Van Nostrand Reinhold Publ., pp. 637-638.
Kyocera Catalog, Ceramic Package, pp. 2-3.
Seraphim, Principles of Electronic Package, Chapter 10, McGram Hill, pp. 282-332.

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