Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-04-08
2008-04-08
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S834000, C029S836000, C029S900000, C257S215000, C385S018000
Reexamination Certificate
active
10434152
ABSTRACT:
A method for making three-dimensional structures comprises providing a plurality of components, each of which is moveably coupled to a substrate. The components may be pivotally coupled to the substrate by one or more micromachined hinges. The components are moved using electrostatic forces which lift the components from the surface of the substrate. The components may then be moved further by providing electrostatic forces between components. Two or more components may engage with one another to provide a three-dimensional structure.
REFERENCES:
patent: 3648281 (1972-03-01), Dahms et al.
patent: 5646928 (1997-07-01), Wu et al.
patent: 5923798 (1999-07-01), Aksyuk et al.
patent: 5945898 (1999-08-01), Judy et al.
patent: 5963367 (1999-10-01), Aksyuk et al.
patent: 5994159 (1999-11-01), Aksyuk et al.
patent: 6498870 (2002-12-01), Wu et al.
patent: 6543087 (2003-04-01), Yeh et al.
K. S. J. Pister, M. W. Judy, S. R. Burgett and R. S. Fearing—“Microfabricated Hinges”,Sensors and Actuators A.vol. 33, No. 3, pp. 249-256, 1992.
M. C. Wu, L. Y. Lin and S. S. Lee—“Micromachined Free-Space Integrated Optics”,Proc. SPIEvol. 2291, Integrated Optics and Microstructures II, San Diego, CA, Jul. 28, 1994.
Nguyen Donghai D.
Oyen Wiggs Green & Mutala LLP
Simon Fraser University
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