Metal fusion bonding – Process – Plural joints
Patent
1999-09-27
2000-08-01
Speer, Timothy
Metal fusion bonding
Process
Plural joints
29827, 22818021, 22818022, 228203, 228226, 2282629, 427 96, 428643, 428645, 428901, B23K 3102
Patent
active
060954043
ABSTRACT:
A method for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8.5 and 11.5% antimony, and the balance of tin provides superior results. The solder uniquely provides a sufficiently low melting point to enable mass flow without destruction of plastic package parts, and a sufficiently high melting point to achieve 200 degrees C. operation. Good mechanical strength is achieved while providing sufficient creep to permit differential expansion between components and a printed wiring board. A heavy solder layer is coated on a printed wiring board and is oxidized to generate a thin solderable layer. Manufacture of the circuit board can be performed with conventional techniques such as wave soldering, hand soldering, solder printing, solder dispensing, and solder pre-forms.
REFERENCES:
patent: 1087561 (1914-02-01), Tebbetts, 2d
Manko, Solders and Soldering, 3.sup.rd Ed., McGraw Hill (1992), pp. 128-139.
Hwang, Modern Solder Technology for Competitive Electronics Manufacturing, McGraw Hill (1996), pp. 80-99.
Atkinson Alan J.
Innova Electronics, Inc.
Koehler Robert R.
Speer Timothy
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