Method for assembling electrolytic capacitor and heat sink

Details Method for assembling electrolytic capacitor and heat sink Method for assembling electrolytic capacitor and heat sink

1999-01-12

2000-09-12

Niebling, John F.

Metal working

Barrier layer or semiconductor device making

Barrier layer device making

361511, 361512, 361514, 361530, 361676, 361688, H01G 900, H01G 208, H02B 100

Patent

active

061171948

ABSTRACT:
An electrolytic capacitor with several conductive layer portions, including some anode layers and some cathode layers in alternating arrangement. A set of insulator layers is interleaved with the conductive layers, and the conductive and insulator layers are laminarly stacked with an anode layer being outermost on one surface. The stack is positioned adjacent a metal heat sink, with an outer insulator layer positioned between and closely contacting the stack and the heat sink. The cathode layers may be connected to the heat sink.

REFERENCES:
patent: 3789502 (1974-02-01), Callins et al.
patent: 3822397 (1974-07-01), Puppolo et al.
patent: 5021927 (1991-06-01), Schweikert et al.
patent: 5131388 (1992-07-01), Pless et al.
patent: 5373418 (1994-12-01), Hayasi
patent: 5400211 (1995-03-01), Evans
patent: 5522851 (1996-06-01), Fayram
patent: 5784247 (1998-07-01), Stevens et al.

Affiliated with

Also associated with

Rating

Method for assembling electrolytic capacitor and heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for assembling electrolytic capacitor and heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for assembling electrolytic capacitor and heat sink will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-92038