Method for assembling cassette-loaded microcomponents

Details Method for assembling cassette-loaded microcomponents Method for assembling cassette-loaded microcomponents

2005-09-20

2005-09-20

Hong, John C. (Department: 3726)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S830000

Reexamination Certificate

active

06944941

ABSTRACT:
Disclosed is a method for assembling cassette-loaded microcomponents, requiring only a small number of component-specific ejector tools and capable of being implemented more quickly. According to the inventive method, at least two cassettes provided with component carriers are used, whereby each cassette has at least one type of component and the positions of the components are adapted to each other. At least one cassette acts as a base plate cassette wherein the microcomponents are arranged on a base plate acting as a component carrier. At least one joint assembly step is carried out, wherein two cassettes are respectively placed opposite each other and all microcomponents in the joined cassettes are simultaneously assembled to form sub-assemblies or component units. The component carriers of the cassettes are subsequently withdrawn. During assembly, the microcomponents can also be held in a rotationally secure position. The invention also relates to an assembly device for assembling cassette-loaded microcomponents.

REFERENCES:
patent: 6851174 (2005-02-01), Ehrfeld et al.
patent: 195 35 971 (1997-04-01), None
patent: 197 09 136 (1998-09-01), None
patent: 198 40 387 (1999-10-01), None

Affiliated with

Also associated with

Rating

Method for assembling cassette-loaded microcomponents does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for assembling cassette-loaded microcomponents, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for assembling cassette-loaded microcomponents will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3439762