Method for assembling an integrated circuit with raised contacts

Details Method for assembling an integrated circuit with raised contacts Method for assembling an integrated circuit with raised contacts

1986-06-24

1988-09-27

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

235492, 357 80, H05K 100

Patent

active

047746335

ABSTRACT:
A device in the form of a contact assembly or package (10) for use in a card (26), such as a credit card. The package includes a substrate (11) having contact holes (16) extending therethrough. The holes are covered by a metal layer (15) on the substrate. Terminals (14) of an integrated circuit (12) are soldered to the metal layer (15) through the holes (16) of the substrate (11). The terminals have a height approximately equal to the thickness of the substrate (11).

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patent: 4603249 (1986-07-01), Hoppe et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4621190 (1986-11-01), Saito et al.

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