Method for assembling an integrated circuit chip package having

Details Method for assembling an integrated circuit chip package having Method for assembling an integrated circuit chip package having

1999-02-19

1999-10-19

Raimund, Christopher

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

438108, 438118, 438119, H01L 2182

Patent

active

059703199

ABSTRACT:
The present invention generally relates to the field of integrated circuit chip packaging. More particularly, the present invention relates to methods of manufacturing integrated circuit chip packages, and methods for electrically connecting and bonding or attaching semiconductor devices to an integrated circuit chip.

REFERENCES:
patent: 3953566 (1976-04-01), Gore
patent: 4482516 (1984-11-01), Bowman et al.
patent: 4705762 (1987-11-01), Ota et al.
patent: 4985296 (1991-01-01), Mortimer Jr.
patent: 5545473 (1996-08-01), Ameen et al.

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