Method for assembling an integrated circuit chip package having

Details Method for assembling an integrated circuit chip package having Method for assembling an integrated circuit chip package having

1998-10-02

1999-07-06

Raimund, Christopher

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156327, 156330, 438115, 438118, H01L 2156

Patent

active

059193298

ABSTRACT:
The present invention generally relates to the field of integrated circuit chip packaging. More particularly, the present invention relates to methods of manufacturing integrated circuit chip packages, and methods for electrically connecting and bonding or attaching semiconductor devices to an integrated circuit chip.

REFERENCES:
patent: 3953566 (1976-04-01), Gore
patent: 4482516 (1984-11-01), Bowman et al.
patent: 4705762 (1987-11-01), Ota et al.
patent: 4985296 (1991-01-01), Mortimer, Jr.
patent: 5545473 (1996-08-01), Ameen et al.

Affiliated with

Also associated with

Rating

Method for assembling an integrated circuit chip package having does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for assembling an integrated circuit chip package having , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for assembling an integrated circuit chip package having will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-896479