Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1999-08-06
2000-01-18
Graybill, David E.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438118, 438125, 438612, H01L 2158, H01L 2160
Patent
active
060157224
ABSTRACT:
The present invention generally relates to the field of integrated circuit chip packaging. More particularly, the present invention relates to methods of manufacturing integrated circuit chip packages, and methods for electrically connecting and bonding or attaching semiconductor devices to an integrated circuit chip.
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Banks Donald R.
Fischer Paul J.
Petefish William G.
Pofahl Ronald G.
Sylvester Mark F.
Genco, Jr. Victor M.
Gore Enterprise Holdings Inc.
Graybill David E.
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