Method for assembling a ball grid array package with...

Details Method for assembling a ball grid array package with... Method for assembling a ball grid array package with...

2007-07-10

2007-07-10

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C438S121000, C257S707000, C257S706000, C257S719000, C257S720000, C257SE23069, C257SE23066

Reexamination Certificate

active

10932278

ABSTRACT:
Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted to a first surface of a first stiffener. A peripheral edge portion of a second surface of the first stiffener is attached to a first surface of a second stiffener to cover an opening through the second stiffener that is open at the first surface and a second surface of the second stiffener. The second surface of the second stiffener is attached to a first surface of a substantially planar substrate that has a plurality of contact pads on the first surface of the substrate. The plurality of contact pads are electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate.

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Ahn, S.H. and Kwon, Y.S., “Popcorn Phenomena in a Ball Grid Array Package”,IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging, IEEE, Aug. 1995, vol. 18, No. 3, pp

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