Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-08-16
2005-08-16
Kim, Paul D (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S609100, C029S834000, C029S835000, C156S250000, C156S257000, C156S277000, C310S31300R, C310S320000, C310S366000, C333S150000, C333S187000, C333S193000, C333S195000, C333S196000
Reexamination Certificate
active
06928718
ABSTRACT:
An assembly and method for array processing of hermetically sealed Surface Acoustic Wave (SAW) Devices employs a non-conductive material having an array of spaced cavities extending into the material for receiving a SAW die face down, in a flip-chip arrangement. Each cavity has a peripheral recess dimensioned to receive a lid for hermetically sealing the die within the cavity. Conductive paths are provided from the interior of the cavity to the surface of the array for providing an electrical contact with the SAW die. Individual SAW devices are then provided by cutting along separation lines between adjacent cavities after a plurality of die have been hermetically sealed within its cavity.
REFERENCES:
patent: 4965227 (1990-10-01), Chang et al.
patent: 5252882 (1993-10-01), Yatsuda
patent: 5332463 (1994-07-01), Eberlein et al.
patent: 5458716 (1995-10-01), Alfaro et al.
patent: 5471011 (1995-11-01), Maslakow
patent: 5585669 (1996-12-01), Venambre
patent: 5611129 (1997-03-01), Yoshimoto et al.
patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 5874321 (1999-02-01), Templeton, Jr. et al.
patent: 6282781 (2001-09-01), Gotoh et al.
patent: 6321444 (2001-11-01), Yatsuda
patent: 6428650 (2002-08-01), Chung
patent: 0 643 482 (1995-03-01), None
patent: 0 803 901 (1997-10-01), None
patent: 0 911 965 (1999-04-01), None
patent: 01188349 (1989-07-01), None
patent: 2000106520 (2000-04-01), None
“New packaging technology for SAW device”, Ando, D.; Oishi, K.; Nakamura, T.; Umeda, S.; Yuzawa, T.; Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International, Dec. 4-6, 1995, Pages(s): 403-406.
Allen Dyer Doppelt Milbrath & Gilchrist, P.A.
Kim Paul D
Sawtekk, Inc.
LandOfFree
Method for array processing of surface acoustic wave devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for array processing of surface acoustic wave devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for array processing of surface acoustic wave devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3508008