Metal fusion bonding – Process – With shaping
Patent
1990-01-16
1992-10-27
Heinrich, Sam
Metal fusion bonding
Process
With shaping
228179, 228214, 445 33, H01J 918, B23K10136
Patent
active
051582287
ABSTRACT:
There is disclosed a method for arranging a plurality of line filaments above the grid electrode supported on the base plate of a conventional fluorescent displaying tube. The inventive method employs a temporary mounting plate for temporarily supporting the filaments with tension until they are completely arranged above the grid electrode. The mounting plate comprises a plurality of cutting-off lines and a pair of weld portions at opposite ends thereof. The arrangement of the filaments accomplished, the temporary mounting plate is cut along the cutting-off lines so as to remove all the other portions except the weld portions.
REFERENCES:
patent: 3745620 (1973-07-01), Koy et al.
patent: 3897614 (1975-08-01), Armstrong
patent: 4666415 (1987-05-01), Morimoto et al.
Heinrich Sam
Samsung Electron Devices Co. Ltd.
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