Method for arranging conductive particles on electrodes of subst

Details Method for arranging conductive particles on electrodes of subst Method for arranging conductive particles on electrodes of subst

1994-06-16

1997-04-01

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562722, 1562724, 156297, 228254, 427272, 427282, B44C 1165

Patent

active

056162065

ABSTRACT:
A method for arranging conductive particles on electrodes of a substrate, which electrically connect with electrodes of an electric part via the conductive particles. An adhesive layer is formed on the electrodes. Conductive particles are arranged on the adhesive layer in a predetermined pattern. Then, the conductive particles on said electrodes of a substrate are affixed thereon.

REFERENCES:
patent: 3486223 (1969-12-01), Butera
patent: 3612955 (1971-10-01), Butherus
patent: 3658618 (1972-04-01), Gramann
patent: 4209552 (1980-06-01), Welch
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4737112 (1988-04-01), Jin
patent: 4740259 (1988-04-01), Heinen
patent: 4744850 (1988-05-01), Imano et al.
patent: 5074947 (1991-12-01), Estes et al.
patent: 5076485 (1991-12-01), MacKay
patent: 5118027 (1992-06-01), Braun et al.
patent: 5170931 (1992-12-01), Desai et al.
patent: 5192835 (1993-03-01), Bull et al.
patent: 5197655 (1993-03-01), Leerssen et al.
patent: 5205896 (1993-04-01), Brown et al.
patent: 5217597 (1993-06-01), Moore et al.
patent: 5219117 (1993-06-01), Lin
patent: 5221417 (1993-06-01), Basavanhally
patent: 5269453 (1993-12-01), Melton et al.
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5323947 (1994-06-01), Juskey et al.
patent: 5332869 (1994-06-01), Hagiwara

Affiliated with

Also associated with

Rating

Method for arranging conductive particles on electrodes of subst does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for arranging conductive particles on electrodes of subst, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for arranging conductive particles on electrodes of subst will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-536015