Method for arranging chips each having an array of semiconductor

Details Method for arranging chips each having an array of semiconductor Method for arranging chips each having an array of semiconductor

1987-07-30

1990-02-13

Hall, Carl E.

Electric lamp or space discharge component or device manufacturi

Process

Combined, e.g., with shaping of lamp or device envelope

29469, 437226, 445 23, H01J 900

Patent

active

049002830

ABSTRACT:
A multiple chip LED linear array including 2048 elements is achieved by a unique wafer dicing technique which allows LEDs in abutting chips to be separated by the same distance as adjacent elements on a single chip. The linear array is employed in photocopy apparatus to discharge a linear segment of a photosensitive drum.

REFERENCES:
patent: 2886748 (1959-05-01), Barton
patent: 3615047 (1971-10-01), Feldman et al.
patent: 4217689 (1980-08-01), Fujii et al.
patent: 4435064 (1984-03-01), Tsukada et al.
patent: 4447126 (1984-05-01), Heidrich et al.
patent: 4451972 (1984-06-01), Batinovich
patent: 4549784 (1985-10-01), Inokuchi
patent: 4553148 (1985-11-01), Behrens et al.
"Dicing Techniques--A Survey" by T. D. Bushman, SCP and Solid State Technology, Nov. 1964, pp. 38-42.
"Diamond Scribers . . . " by L. Curran, Electronics, Nov. 23, 1970, pp. 70-73.
IBM Technical Disclosure Bulletin, vol. 21, No. 8, Jan. 1979.

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