Package making – With cover-adjunct application or formation – Adjunct comprising provision to secure cover
Patent
1995-05-31
1996-09-03
Larson, Lowell A.
Package making
With cover-adjunct application or formation
Adjunct comprising provision to secure cover
53451, 531334, B65B 5104
Patent
active
055512089
ABSTRACT:
A method for manufacturing reclosable packages on a form, fill and seal machine includes the step of providing a continuous sheet of thermoplastic material with a Z-fold extending longitudinally therealong before the sheet is wrapped around a filling tube for forming and filling the packages. The Z-fold is maintained on the tube of thermoplastic material thus formed until it reaches a loop opener on the outside surface of the filling tube. The loop opener transforms the Z-fold into a loop extending longitudinally along and outwardly from the filling tube and from the tube of thermoplastic material wrapped therearound. Simultaneously, a continuous plastic zipper having a pair of mutually interlocking profiles is directed into the tube of thermoplastic material along a channel on the outside surface of the filling tube. The zipper is ultimately guided out from the channel, through the loop opener and into the loop, and is sealed thereto to form the reclosable openings for the plastic packages being manufactured.
REFERENCES:
patent: 4993212 (1991-02-01), Veoukas
patent: 5014498 (1991-05-01), McMahon
patent: 5046300 (1991-09-01), Custer et al.
patent: 5127208 (1992-07-01), Custer et al.
patent: 5425216 (1995-06-01), Ausnit
Kim Gene L.
Larson Lowell A.
Minigrip Inc.
LandOfFree
Method for applying zipper to film at tube on a form-fill-and-se does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for applying zipper to film at tube on a form-fill-and-se, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for applying zipper to film at tube on a form-fill-and-se will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1943967