Method for applying solder to printed wiring boards and printed

Details Method for applying solder to printed wiring boards and printed Method for applying solder to printed wiring boards and printed

1991-12-02

1992-12-22

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

228254, 427123, 4273837, 427360, H05K 334

Patent

active

051728532

ABSTRACT:
A method for applying solder to printed wiring boards includes producing a printed wiring board with electrically conductive regions. Soldering paste is applied as a solder deposit on the electrically conductive regions. The solder deposits are melted to form hump-shaped solid solder applications joined to the printed wiring board. The hump-shaped solder applications are levelled out by areally applying pressure to the solder applications in the direction of the printed wiring board. A printed wiring board to which solder has been applied includes a wiring board surface having regions to be equipped with components according to an SMD process. Solder applications are disposed on the regions in the form of a solid solder layer. The solid solder layer has a pressed or rolled surface extended substantially parallel to the wiring board surface.

REFERENCES:
patent: 2615768 (1952-10-01), Schluchter
patent: 4485166 (1984-11-01), Herwig et al.
patent: 4752027 (1988-06-01), Gschwend
Metals Handbook Ninth Edition, vol. 6, p. 1071, copyright 1983.
Derwent-Wpil, No. 89-367154, Derwent Publications Ltd, London, GB.
Dr.-Ing. Dieter Friedrich (SMW Electronik GmbH) SMT/ASIC Hybrid 1990 Int. Conf. pp. 1-12 "Optipad-Eine Leiterplattenoberfl a/ che zur proze.beta.technischen . . . ".

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