Method for applying solder to and mounting components on printed

Details Method for applying solder to and mounting components on printed Method for applying solder to and mounting components on printed

1992-08-14

1993-12-21

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural diverse bonding

228254, H05K 334

Patent

active

052715485

ABSTRACT:
A method for applying solder to and mounting components on printed circuit boards, includes applying a solder paste to electrically conductive regions of a printed circuit board to form solder deposits, and subsequently melting the solder deposits into solder applications joined to the conductive regions. The components are joined to the printed circuit board with an adhesive applied to the printed circuit board between the electrically conductive regions, while assigning each of the electrically conductive regions to a respective one of the components. A flux is applied and a soldering process is performed.

REFERENCES:
patent: 4208005 (1980-06-01), Nate et al.
patent: 4738732 (1988-04-01), Anderson et al.
patent: 4752027 (1988-06-01), Gschwend
patent: 4821948 (1989-04-01), Fisher et al.
patent: 5051339 (1991-09-01), Friedrich et al.
patent: 5145531 (1992-09-01), Turner et al.
M. Kunze "Baugreppenrationalisiering und Obertlcichenmontage" Aug. 1987, radiofernsehen, electronic, pp. 479-483.

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