Method for applying solder to a fine pitch flip chip pattern

Details Method for applying solder to a fine pitch flip chip pattern Method for applying solder to a fine pitch flip chip pattern

1994-02-22

1996-01-09

Bradley, P. Austin

Metal fusion bonding

Process

With disassembling of bonded joint

228254, B23K 1018, B23K 3102

Patent

active

054822009

ABSTRACT:
A method is provided for applying solder to a flip chip pattern on a circuit board. The method involves forming solder bumps on a chip, and then transferring the solder bumps to the flip chip pattern by soldering the chip to the flip chip pattern, and then gradually heating the solder bumps while applying a force to separate the chip from the circuit board, such that the solder bumps substantially remain adhered to the flip chip pattern. The solder is transferred to the flip chip pattern in order to allow a flexible circuit interconnect to be soldered to the flip chip pattern for the purpose of establishing electronic communications between the circuit board's electronic circuit components and a microprocessor emulator. The electronic circuit can then be evaluated and tested without a microprocessor chip being present on the substrate.

REFERENCES:
patent: 4494688 (1986-01-01), Hatada et al.
patent: 4552300 (1985-11-01), Zovko et al.
patent: 4898320 (1990-02-01), Dunaway et al.
patent: 5323947 (1994-06-01), Juskey et al.
patent: 5438749 (1995-08-01), Runyon

Affiliated with

Also associated with

Rating

Method for applying solder to a fine pitch flip chip pattern does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for applying solder to a fine pitch flip chip pattern, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for applying solder to a fine pitch flip chip pattern will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1297910