Method for applying mold release coating to separator plates for

Plastic and nonmetallic article shaping or treating: processes – With step of cleaning – polishing – or preconditioning...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

264104, 264154, 264219, 26427211, 264338, 1563073, 427133, 427387, 427421, B28B 738, B28B 1104

Patent

active

050645838

ABSTRACT:
A method of conditioning separator mold plates for repeated use in high temperature sequential molding of printed circuit board laminates comprises the step of integrally applying at least one thin, continuous coat, preferably on the order of about 1 microinch, of a silane-based mold release composition prior to each sequential molding operation for facilitating repeated use of the plates in sequential molding operations the silane-based mold release composition is preferably applied in a continuous automated process including a spray gun, preferably of an air atomized type and more preferably of a high transfer efficiency type, for applying the coating followed by an infrared heating step, the separator mold plates being carried by a conveyor through a tunnel including the spray gun and infrared heater. Separator mold plates formed as a product of the process are adapted for use in large numbers of sequential molding operations with an additional coat of the silane-based mold release compound being applied prior to each operation because of the microinch thickness of each coating.

REFERENCES:
patent: 2674619 (1954-04-01), Lundsted
patent: 2786080 (1957-03-01), Patton Jr.
patent: 3290760 (1966-12-01), Cave
patent: 3421211 (1969-01-01), Eaves et al.
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 4201616 (1980-05-01), Chellis et al.
patent: 4371476 (1983-02-01), Newkirk et al.
patent: 4571279 (1986-02-01), Oizumi et al.
patent: 4713284 (1987-12-01), Hasegawa et al.
patent: 4753847 (1988-06-01), Wilheim et al.
patent: 4855184 (1989-08-01), Klun et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for applying mold release coating to separator plates for does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for applying mold release coating to separator plates for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for applying mold release coating to separator plates for will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1011631

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.