Method for applying mold release coating to separator plates for

Details Method for applying mold release coating to separator plates for Method for applying mold release coating to separator plates for

1989-08-01

1991-11-12

Lorin, Hubert C.

Plastic and nonmetallic article shaping or treating: processes

With step of cleaning, polishing, or preconditioning...

264104, 264154, 264219, 26427211, 264338, 1563073, 427133, 427387, 427421, B28B 738, B28B 1104

Patent

active

050645838

ABSTRACT:
A method of conditioning separator mold plates for repeated use in high temperature sequential molding of printed circuit board laminates comprises the step of integrally applying at least one thin, continuous coat, preferably on the order of about 1 microinch, of a silane-based mold release composition prior to each sequential molding operation for facilitating repeated use of the plates in sequential molding operations the silane-based mold release composition is preferably applied in a continuous automated process including a spray gun, preferably of an air atomized type and more preferably of a high transfer efficiency type, for applying the coating followed by an infrared heating step, the separator mold plates being carried by a conveyor through a tunnel including the spray gun and infrared heater. Separator mold plates formed as a product of the process are adapted for use in large numbers of sequential molding operations with an additional coat of the silane-based mold release compound being applied prior to each operation because of the microinch thickness of each coating.

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