Method for applying material to a semiconductor wafer

Details Method for applying material to a semiconductor wafer Method for applying material to a semiconductor wafer

1985-07-29

1986-12-09

Smith, John D.

Coating processes

Radioactive base or coating

430308, 430330, 427 82, H01L 21312

Patent

active

046279881

ABSTRACT:
Passivation, alpha protection and other relatively thick, patterned layers are applied to semiconductor wafers by a screen printing method. Patterned emulsions carried on fine mesh stainless steel screens are tempered at elevated temperatures to harden the emulsion. The screens so prepared withstand many cycles of printing and cleaning with harsh solvents present in screenable polymers such as polyimide and rigid silicone.

REFERENCES:
patent: 3425831 (1969-02-01), Poole
patent: 3507654 (1970-04-01), Wrench
patent: 4246147 (1981-01-01), Bakas
patent: 4362808 (1982-12-01), Otthofer

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