Method for applying flowable materials

Metal working – Method of mechanical manufacture – With testing or indicating

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S458000, C029S527100, C029S527200, C427S409000, C425S149000, C425S162000, C425S19200R

Reexamination Certificate

active

07467452

ABSTRACT:
Methods and apparatuses are disclosed for applying melt flowable materials to components of articles of manufacture. The methods and apparatuses disclosed herein are concerned with formation of appropriate flowable materials, control over the manner in which the flowable materials are applied, treatment of the components prior to application of the flowable materials and the like. Moreover, the apparatuses and methods may be particularly suited for applying flowable materials to surfaces and components found in automotive, aerospace, and marine vehicles.

REFERENCES:
patent: 4083384 (1978-04-01), Horne et al.
patent: 4399174 (1983-08-01), Tanaka et al.
patent: 4437046 (1984-03-01), Faillace
patent: 4448736 (1984-05-01), Emery et al.
patent: 4610836 (1986-09-01), Wycech
patent: 4813690 (1989-03-01), Coburn, Jr.
patent: 4853270 (1989-08-01), Wycech
patent: 4922596 (1990-05-01), Wycech
patent: 4923902 (1990-05-01), Wycech
patent: 4978562 (1990-12-01), Wycech
patent: 5085021 (1992-02-01), Kuhnert
patent: 5124186 (1992-06-01), Wycech
patent: 5266133 (1993-11-01), Hanley et al.
patent: 5336349 (1994-08-01), Cornils et al.
patent: 5358397 (1994-10-01), Ligon et al.
patent: 5382397 (1995-01-01), Turner, Jr.
patent: 5507994 (1996-04-01), Cornils et al.
patent: 5544930 (1996-08-01), Stedman
patent: 5554325 (1996-09-01), Kotte et al.
patent: 5693174 (1997-12-01), Nakata et al.
patent: 5755486 (1998-05-01), Wycech
patent: 5766719 (1998-06-01), Rimkus
patent: 5846465 (1998-12-01), Tsujino et al.
patent: 5878784 (1999-03-01), Sales et al.
patent: 5932680 (1999-08-01), Heider
patent: 6030701 (2000-02-01), Johnson et al.
patent: 6053210 (2000-04-01), Chapman et al.
patent: 6093358 (2000-07-01), Schiewe et al.
patent: 6103341 (2000-08-01), Barz et al.
patent: 6135541 (2000-10-01), Geise et al.
patent: 6253819 (2001-07-01), Frendle et al.
patent: 6254488 (2001-07-01), Hill
patent: 6270600 (2001-08-01), Wycech
patent: 6321793 (2001-11-01), Czaplicki et al.
patent: 6383610 (2002-05-01), Barz et al.
patent: 6389775 (2002-05-01), Steiner et al.
patent: 6406078 (2002-06-01), Wycech
patent: 6419305 (2002-07-01), Larsen
patent: 6444713 (2002-09-01), Pachl et al.
patent: 6467834 (2002-10-01), Barz et al.
patent: 6471285 (2002-10-01), Czaplicki et al.
patent: 6482486 (2002-11-01), Czaplicki et al.
patent: 6533866 (2003-03-01), Franz et al.
patent: 6550847 (2003-04-01), Honda et al.
patent: 6561571 (2003-05-01), Brennecke
patent: 6607831 (2003-08-01), Ho et al.
patent: 6634698 (2003-10-01), Kleino
patent: 6668457 (2003-12-01), Czaplicki
patent: 6752451 (2004-06-01), Sakamoto
patent: 6811864 (2004-11-01), Czaplicki et al.
patent: 6820923 (2004-11-01), Bock
patent: 7004536 (2006-02-01), Wieber
patent: 7041193 (2006-05-01), Bogert et al.
patent: 7043815 (2006-05-01), Lande et al.
patent: 7180027 (2007-02-01), Hable et al.
patent: 2001/0042353 (2001-11-01), Honda et al.
patent: 2002/0066254 (2002-06-01), Ebbinghaus
patent: 2002/0164450 (2002-11-01), Lupini et al.
patent: 2003/0140671 (2003-07-01), Lande et al.
patent: 2003/0184121 (2003-10-01), Czaplicki et al.
patent: 2003/0201572 (2003-10-01), Coon et al.
patent: 2003/0209921 (2003-11-01), Coon et al.
patent: 2004/0011282 (2004-01-01), Myers et al.
patent: 2004/0018353 (2004-01-01), Czaplicki et al.
patent: 2004/0046423 (2004-03-01), Wieber
patent: 2004/0135058 (2004-07-01), Wycech
patent: 2004/0180206 (2004-09-01), Czaplicki et al.
patent: 2004/0195817 (2004-10-01), Tarbutton et al.
patent: 2004/0262810 (2004-12-01), Barz et al.
patent: 2004/0262853 (2004-12-01), Larsen et al.
patent: 2005/0217785 (2005-10-01), Hable et al.
patent: 2005/0268454 (2005-12-01), White
patent: 2005/0285292 (2005-12-01), Mendiboure et al.
patent: 2006/0144513 (2006-07-01), Bogert et al.
patent: 299 04 705 (1999-07-01), None
patent: 0 588 182 (1994-03-01), None
patent: 0 748 683 (1996-06-01), None
patent: 0 748 682 (1996-12-01), None
patent: 0 755 768 (1997-01-01), None
patent: 0 775 721 (1997-05-01), None
patent: 1 182 087 (2002-02-01), None
patent: 1 428 744 (2004-06-01), None
patent: 1 134 314 (2004-09-01), None
patent: 1 471 105 (2004-10-01), None
patent: 1 518 739 (1975-12-01), None
patent: 1 518 739 (1978-07-01), None
patent: 2105064 (1983-03-01), None
patent: 2 302 360 (1997-01-01), None
patent: WO 89/06595 (1989-07-01), None
patent: WO 99/36243 (1999-07-01), None
patent: WO 99/48746 (1999-09-01), None
patent: WO 00/10802 (2000-03-01), None
patent: WO 00/27920 (2000-05-01), None
patent: WO 00/38863 (2000-07-01), None
patent: WO 00/46461 (2000-08-01), None
patent: WO 02/055923 (2002-07-01), None
patent: WO2004/067304 (2004-08-01), None
patent: WO 2004/078451 (2004-09-01), None
patent: WO2005/080524 (2005-09-01), None
patent: WO2005/105441 (2005-11-01), None
Copending U.S. Appl. No. 09/939,245, filed Aug. 24, 2001.
Copending U.S. Appl. No. 09/858,939, filed May 16, 2001.
Copending U.S. Appl. No. 09/459,756, filed Dec. 10, 1999.
Copending U.S. Appl. No. 09/676,725, filed Sep. 29, 2000.
Copending U.S. Appl. No. 09/923,138, filed Aug. 6, 2001.
Copending U.S. Appl. No. 09/631,211, filed Aug. 3, 2000.
Copending U.S. Appl. No. 10/216,944, filed Aug. 12, 2002.
Copending U.S. Appl. No. 60/413,493, filed Sep. 25, 2002.
Copending U.S. Appl. No. 10/217,991, filed Aug. 13, 2002.
Copending U.S. Appl. No. 60/415,511, filed Oct. 2, 2002.
Copending U.S. Appl. No. 60/399,742, filed Jul. 30, 2002.
Mansour et al., Optimal Bonding Thickness for Vehicle Stiffness.
European Search Report dated Aug. 31, 2004. Application No. EP 03 07 5228 (1001.073EP).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for applying flowable materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for applying flowable materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for applying flowable materials will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4043845

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.