Method for applying curable fill compositon to apertures in a su

Details Method for applying curable fill compositon to apertures in a su Method for applying curable fill compositon to apertures in a su

1997-10-30

1999-03-30

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29840, 2281801, 427 97, H05K 312, H05K 342, H05K 334

Patent

active

058873457

ABSTRACT:
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

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