Method for applying and monitoring an application structure...

Details Method for applying and monitoring an application structure... Method for applying and monitoring an application structure...

2011-01-25

2011-01-25

Koch, III, George R (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S094000, C156S351000, C156S356000, C156S378000

Reexamination Certificate

active

07875137

ABSTRACT:
A method for applying and monitoring an application structure comprising a repairing function and device thereof are provided. The method includes arranging automatically a first application structure on the substrate using the application device. The first application structure on the substrate monitored by the at least one camera such that the at least one camera is constantly aligned to the first application structure and the first application structure. The method further includes transmitting the images acquired by the at least one camera to an image processing device that analyzes the images of the first application structure and the image processing device filing partial areas of the first application structure. The method also includes applying, after application of all partial areas of the first application structure, at least a second application structure to the substrate by the application device based on the repair list.

REFERENCES:
patent: 6776845 (2004-08-01), Minami et al.
patent: 7364775 (2008-04-01), Klein
patent: 7488388 (2009-02-01), Ryu et al.
patent: 7488505 (2009-02-01), Minami et al.
patent: 2007/0292629 (2007-12-01), Linnenkohl et al.
patent: WO 96/34273 (1996-10-01), None
patent: WO 03/021534 (2003-03-01), None
International Search Report for International Application No. PCT/EP2007/003398 dated Jul. 25, 2007, (11) pgs.

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