Method for applying a thin adherent layer

Details Method for applying a thin adherent layer Method for applying a thin adherent layer

1989-02-28

1995-05-30

Nelson, Peter A.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

20419235, 20429807, C23C 1400

Patent

active

054198224

ABSTRACT:
A method for applying an extremely thin layer of an adherent material to a substrate at a controllable rate. The disclosed embodiment provides a method for depositing a thin layer of titanium, typically much less than 100 Angstroms, on a silicon dioxide substrate layer in order to provide the necessary adhesion for a metallic film. A silicon wafer having a layer of silicon dioxide is placed on a titanium precoated carrier in an evacuated chamber. The wafer and carrier are then sputter etched using argon as a sputter etchant while titanium is deposited onto the wafer. The ratio of deposition rate to etching rate is controlled to provide a very low effective deposition rate. Thus, while the surface is being atomically cleaned, the adhesive layer is simultaneously deposited. A film of a noble metal, typically platinum, may then be deposited onto the adhesive layer. In an alternative embodiment, the titanium is sputter deposited from a target while the substrate is simultaneously sputter etched.

REFERENCES:
patent: 3451912 (1969-06-01), Dheurler et al.
patent: 3661747 (1972-05-01), Byrnes, Jr. et al.
patent: 3836446 (1974-09-01), Tiefert
patent: 4129848 (1978-12-01), Frank et al.
patent: 4468437 (1984-08-01), Patten et al.
patent: 4756810 (1988-07-01), Lamont, Jr. et al.
patent: 4816126 (1989-03-01), Kamoshida et al.

Affiliated with

Also associated with

Rating

Method for applying a thin adherent layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for applying a thin adherent layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for applying a thin adherent layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-359389