Method for applying a substrate

Details Method for applying a substrate Method for applying a substrate

2005-01-11

2005-01-11

Aftergut, Jeff H. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S285000, C438S118000

Reexamination Certificate

active

06841027

ABSTRACT:
A method for applying a thin-walled, flat substrate, such as a wafer, to an assembly carrier with a preferably level protective layer, for example a wax. With respect to the protective layer, the substrate is arranged at a spacing and is curved in a convex manner. The substrate is contacted with the protective layer. Finally, the substrate is laid over the entire protective layer from the contact point towards the edge of the substrate.

REFERENCES:
patent: 3322598 (1967-05-01), Marks et al.
patent: 3554834 (1971-01-01), Bennett et al.
patent: 5284538 (1994-02-01), Suzuki et al.
patent: 5733410 (1998-03-01), Gore et al.
patent: 6484383 (2002-11-01), Herklotz
patent: 43 32 488 (1996-05-01), None
patent: 55-2020 (1980-01-01), None
patent: 9925019 (1999-05-01), None

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