Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1980-06-02
1981-11-17
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427282, 427369, 118505, 430315, H05K 300
Patent
active
043011896
ABSTRACT:
A method of manufacturing a printed wiring board completely free from trouble of solder bridging. The printed wiring board of the present invention is provided with a raised portion of solder resist ink in the form of a ridge around the periphery of the land to be printed or at an area between adjacent lands to be soldered, the said raised portion being an extension of a solder resist thin layer coated on the insulator base board exclusive the said land. The method for manufacturing the aforesaid printed wiring borad comprises the steps of placing an ink-permeable mesh screen above the insulator base board with an anti-ink-permeable membrane piece closely contacted with the land to be printed, the said mesh screen being integrally provided with the said anti-ink-permeable membrane piece having the same shape and located at the same position as that the said land, applying resist ink over the said mesh screen, and performing printing operation with the aid of a squeezing device which serves to depress the mesh screen onto the insulator base board is also provided in accordance with the present invention. Protrusion of the said integrally fastened anti-ink-permeable membrane piece from the said mesh screen, that is, the substantial thickness of the said membrane piece is specified in the range of 40 to 100 .mu.m.
REFERENCES:
patent: 3266127 (1966-08-01), Harding et al.
patent: 3772160 (1973-11-01), Arndt
patent: 4064287 (1977-12-01), Lipson et al.
patent: 4084506 (1978-04-01), Nakatani
patent: 4185378 (1980-01-01), Machida
Arai Minoru
Baba Akio
Plantz Bernard F.
Smith John D.
Tokyo Print Co., Ltd.
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