Method for applying a resist layer, uses of adhesive...

Details Method for applying a resist layer, uses of adhesive... Method for applying a resist layer, uses of adhesive...

2010-03-29

2011-11-29

Walke, Amanda C. (Department: 1722)

Radiation imagery chemistry: process, composition, or product th

Stripping process or element

Forming nonplanar image

C430S260000, C430S329000

Reissue Patent

active

RE042980

ABSTRACT:
A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.

REFERENCES:
patent: 3469982 (1969-09-01), Celeste
patent: 3683060 (1972-08-01), Tanabe et al.
patent: 3961961 (1976-06-01), Rich
patent: 4050936 (1977-09-01), Takeda et al.
patent: 4211560 (1980-07-01), Taguchi et al.
patent: 4289841 (1981-09-01), Cohen et al.
patent: 4318975 (1982-03-01), Kuznetsov et al.
patent: 4323637 (1982-04-01), Chen et al.
patent: 4349620 (1982-09-01), Cyr et al.
patent: 4357413 (1982-11-01), Cohen et al.
patent: 4528261 (1985-07-01), Hauser
patent: 4571374 (1986-02-01), Vikesland
patent: 4649100 (1987-03-01), Leyrer et al.
patent: 4652513 (1987-03-01), Pentak et al.
patent: 4698294 (1987-10-01), Lau et al.
patent: 4826705 (1989-05-01), Drain et al.
patent: 5015059 (1991-05-01), Booth et al.
patent: 5049623 (1991-09-01), Dupont
patent: 5077174 (1991-12-01), Bauer et al.
patent: 5106450 (1992-04-01), Freisitzer et al.
patent: 5239029 (1993-08-01), Yaguchi
patent: 5242756 (1993-09-01), Hensel et al.
patent: 5378298 (1995-01-01), Williams et al.
patent: 5378583 (1995-01-01), Guckel et al.
patent: 5759336 (1998-06-01), Yamamoto et al.
patent: 5959011 (1999-09-01), Mizuno et al.
patent: 6040110 (2000-03-01), Shirai et al.
patent: 6100006 (2000-08-01), Taylor, Jr. et al.
patent: 6465092 (2002-10-01), Takushima et al.
patent: 6842288 (2005-01-01), Liu et al.
patent: 7005176 (2006-02-01), Tojo et al.
patent: 2003/0091926 (2003-05-01), Shelnut
patent: 0431 637 (1991-06-01), None
patent: 0 553 638 (1993-08-01), None
patent: 0 559 248 (1993-09-01), None
patent: 1 229 388 (2002-08-01), None
patent: 09147751 (1997-06-01), None
German Office Action Dated Jul. 2, 2009 and English Translation.
S. Wolf, R.N. Tauber,Silicon Processing for the VLSI Era. Volumne 1: Process Technology,Sunset Beach, California, U.S.A., Lattice Press, 1986, S. 437-441. ISBN 0-961672-3-7.
F. Pedrotti, L. Pedrotti, W. Bausch, H. Schmidt,Optik: eine Einführung, München,London, Mexico, New York, Singapur, Sydney, Toronot: Prenitce Hall, 1996, S. 309-315. ISBN 3-8272-9510-6 with English Translation.
U.S. Appl. No. 11/943,145 Office Action Dated Mar. 20, 2009.
U.S. Appl. No. 11/943,145 Final Office Action Dated Oct. 15, 2009.
U.S. Appl. No. 11/943,145 Office Action Dated Jan. 27, 2010.
Final Office Action for U.S. Appl. No. 11/943,145, Dated Jun. 23, 2010.
Notice of Allowance for U.S. Appl. No. 11/943,145, Dated Apr. 11, 2010.

Affiliated with

Also associated with

Rating

Method for applying a resist layer, uses of adhesive... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for applying a resist layer, uses of adhesive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for applying a resist layer, uses of adhesive... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4259157