Radiation imagery chemistry: process – composition – or product th – Stripping process or element – Forming nonplanar image
Reexamination Certificate
2011-08-23
2011-08-23
Walke, Amanda C. (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Stripping process or element
Forming nonplanar image
C430S260000, C430S329000
Reexamination Certificate
active
08003292
ABSTRACT:
A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.
REFERENCES:
patent: 3469982 (1969-09-01), Celeste
patent: 3683060 (1972-08-01), Tanabe et al.
patent: 3961961 (1976-06-01), Rich
patent: 4050936 (1977-09-01), Takeda et al.
patent: 4211560 (1980-07-01), Taguchi et al.
patent: 4289841 (1981-09-01), Cohen et al.
patent: 4318975 (1982-03-01), Kuznetsov et al.
patent: 4323637 (1982-04-01), Chen et al.
patent: 4349620 (1982-09-01), Cyr et al.
patent: 4357413 (1982-11-01), Cohen et al.
patent: 4528261 (1985-07-01), Hauser
patent: 4571374 (1986-02-01), Videsland
patent: 4649100 (1987-03-01), Leyrer et al.
patent: 4652513 (1987-03-01), Pentak et al.
patent: 4698294 (1987-10-01), Lau et al.
patent: 4826705 (1989-05-01), Drain et al.
patent: 5015059 (1991-05-01), Booth et al.
patent: 5049623 (1991-09-01), Dupont
patent: 5077174 (1991-12-01), Bauer et al.
patent: 5106450 (1992-04-01), Freisitzer et al.
patent: 5239029 (1993-08-01), Yaguchi
patent: 5242756 (1993-09-01), Hensel et al.
patent: 5378298 (1995-01-01), Williams et al.
patent: 5759336 (1998-06-01), Yamamoto et al.
patent: 5959011 (1999-09-01), Mizuno et al.
patent: 6040110 (2000-03-01), Shirai et al.
patent: 6100006 (2000-08-01), Taylor, Jr. et al.
patent: 6465092 (2002-10-01), Takushima et al.
patent: 6842288 (2005-01-01), Liu et al.
patent: 7005176 (2006-02-01), Tojo et al.
patent: 2003/0091926 (2003-05-01), Shelnut
patent: 0431 637 (1991-06-01), None
patent: 0 553 638 (1993-08-01), None
patent: 0 559 248 (1993-09-01), None
patent: 1 299 388 (2002-08-01), None
patent: 09147751 (1997-06-01), None
German Office Action Dated Jul. 2, 2009 and English Translation.
S. Wolf, R.N. Tauber,Silicon Processing for the VLSI Era. vol. 1:Process Technology, Sunset Beach, California, U.S.A., Lattice Press, 1986, S. 437-441. ISBN 0-961672-3-7.
F. Pedrotti, L. Pedrotti, W. Bausch, H. Schmidt,Optik: eine Einführung, München, London, Mexico, New York, Singapur, Sydney, Toronot: Prenitce Hall, 1996, S. 309-315. ISBN 3-8272-9510-6 with English Translation.
S. Wolf, R.N. Tauber,Silicon Processing for the VLSI Era. vol. 1:Process Technology, Sunset Beach, California, U.S.A., Lattice Press, 1986, S. 437-441. ISBN 0-961672-3-7.
F. Pedrotti, L. Pedrotti, W. Bausch, H. Schmidt,Optik: eine Einführung, München, London, Mexico, New York, Singapur, Sydney, Toronot: Prenitce Hall, 1996, S. 309-315. ISBN 3-8272-9510-6 with English Translation.
Kroeninger Werner
Schneegans Manfred
Infineon - Technologies AG
Walke Amanda C.
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