Method for applying a moistureproof insulative coating to printe

Details Method for applying a moistureproof insulative coating to printe Method for applying a moistureproof insulative coating to printe

1988-06-13

1989-11-14

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4272071, 427420, 427421, B05D 512

Patent

active

048806633

ABSTRACT:
A method of applying coating material to only selected areas of a packaged printed circuit board wherein the coating material is supplied to a flat-pattern nozzle at a pressure sufficient to produce a liquid film emission in a flat triangular or dovetail shaped pattern which portion of the nozzle emission is substantially free of atomized particles. The circuit board is positioned relative the nozzle to place the board in the path of the film pattern and relative movement between the nozzle and board is effect in conjunction with controlling the supply of coating to the nozzle to coat only desired regions of the board while avoiding deposit of coating material on areas to be left uncoated.

REFERENCES:
patent: 3526535 (1970-09-01), Plumat
patent: 3852095 (1974-12-01), Hogstrom
patent: 4337281 (1982-06-01), Boone
patent: 4490496 (1984-12-01), Maekawa
patent: 4600601 (1986-07-01), Tamura
patent: 4711835 (1987-12-01), Dufour
patent: 4753819 (1988-06-01), Shimada
IBM Technical Disclosure Bulletin, vol. 7, No. 11, Apr. 1965.

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