Method for applying a hot melt adhesive pattern to a moving subs

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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53383, 493129, 493189, 118313, 118669, 118682, 118702, 118DIG3, 156 69, 156 78, 156290, 156356, 427286, 427422, 4272082, 428310, 428314, B05D 102, B05B 1204, B05D 510, B31B 162

Patent

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042565260

ABSTRACT:
Hot melt adhesive is applied to a moving substrate in a pattern including at least two lines which extend transversely to one another, by conveying the substrate past a nozzle orifice through which a first line of molten adhesive is applied, as by extrusion, to the substrate parallel to the direction of substrate movement and, while continuing to move the substrate in the same direction, projecting another portion of the molten hot melt adhesive onto the substrate as a burst in the form of a flat sheet issuing from a fan spray orifice, this orifice being oriented so that the sheet is projected transversely to the direction of substrate movement, and terminating the burst so rapidly that the adhesive so projected is deposited on the moving substrate in the form of a line having a length in the crosswise direction that is several times its width.

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patent: 4156754 (1979-05-01), Cobbs et al.

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