Method for applying a coating solution

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate

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427 58, 427348, 4273722, 4274432, 427544, 427591, B05D 302

Patent

active

052982920

ABSTRACT:
A method for applying a coating solution onto a substrate to form a coated portion thereon includes a dipping device for dipping and removing the substrate into and from the coating solution; and a heating device for inductively heating the substrate while the dipping device removes the substrate from the coating solution to uniformly dry an inner surface of the coated portion, the inner surface being adjacent to the substrate. The method advantageously may include a drying device for blowing hot gases onto the coated portion of the substrate while the dipping device removes the substrate from the coating solution. The drying device for blowing hot gases onto the coated portion of the substrate includes a plurality of slits arranged so that a plurality of hot gas streams flowing through corresponding ones of the plurality of slits impinge and exert a gas pressure on the coated portion, the plurality of slits being arranged so that a collective gas pressure from all hot gas streams is uniformly applied across the coated portion along a transverse direction so that the coated portion is squeezed to a uniform thickness as the dipping device removes the substrate.

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