Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Making hole or aperture in article
Patent
1997-08-29
2000-03-21
Silbaugh, Jan H.
Plastic and nonmetallic article shaping or treating: processes
With severing, removing material from preform mechanically,...
Making hole or aperture in article
264230, 264237, 264296, 264322, 264342R, 264348, 425290, B29C 5500, B29C 6102, B29C 5904
Patent
active
060399066
ABSTRACT:
A method for aperturing a laminate. The first step is to provide a laminate having at least one nonwoven web of thermoplastic fibers and at least one elastic member. The laminate is forwarded through a pressure biased nip having a relief patterned nip defining member having a plurality of pattern elements and a nip defining anvil member. The nip defining members are biased towards each other with a predetermined pattern-element loading. Each nip defining member is heated to a temperature that is sufficiently above the melt temperature of the thermoplastic fibers of the nonwoven web and above the melt temperature of the elastic member to enable aperturing of the laminate.
REFERENCES:
patent: 3187380 (1965-06-01), Harrison
patent: 4407284 (1983-10-01), Pieniak
patent: 5234423 (1993-08-01), Alemany et al.
patent: 5296184 (1994-03-01), Wu et al.
patent: 5571096 (1996-11-01), Dobrin et al.
patent: 5628097 (1997-05-01), Benson et al.
patent: 5656119 (1997-08-01), Srinivasan et al.
patent: 5704101 (1998-01-01), Majors et al.
Morimoto Koichi
Sageser David Mark
Shirakawa Takuya
Johnson Kevin C.
Miller Steven W.
Poe Michael
Rasser Jacobus C.
Silbaugh Jan H.
LandOfFree
Method for aperturing a laminate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for aperturing a laminate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for aperturing a laminate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-727802