Method for annealing an electrodeposition structure

Details Method for annealing an electrodeposition structure Method for annealing an electrodeposition structure

2006-12-12

2006-12-12

Heckenberg, Donald (Department: 1722)

Static molds

Container-type molding device

Of named component

C148S516000, C148S675000, C205S070000

Reexamination Certificate

active

07147201

ABSTRACT:
A method for annealing a structure formed by electrodeposition is provided, the method comprising providing the electrodeposition structure, the electrodeposition structure comprising an electroformed mold, the electroformed mold having a nominal thickness between and including 0.5 mm to 8.0 mm and having a melting temperature; heating the electrodeposition structure to a temperature between ambient temperature and the melting temperature of the electrodeposition structure; isostatically pressurizing the electrodeposition structure to a pressure above ambient pressure; cooling the electrodeposition structure to ambient temperature; and depressurizing the electrodeposition structure to ambient pressure.

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