Method for analyzing the addition agents in solutions for electr

Chemistry: electrical and wave energy – Processes and products – Processes of treating materials by wave energy

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204413, 204405, 204434, G01N 2726

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active

051960966

ABSTRACT:
A method for measuring concentrations of addition agents in solutions of additive mixtures, namely for monitoring additives in PbSn plating solutions, comprising the steps of: (a) preparing a basis solution which contains an electroactive species whose electroreduction reaction is sensitive to the additive of interest; (b) preparing calibration standard sample solutions comprising appropriate concentrations of all species other than the additive; (c) preparing the working solution whose additive concentration is to be determined; (d) applying a pulse voltammetry technique, at a hanging Hg drop electrode, to a sample of the basis solution located in a cell of a polarographic analyzer; (e) thereafter measuring the polarographic peak height for the indicator reaction in the basis solution; (f) adding a measured amount of the working solution to the basis solution sample in the cell; (g) thereafter measuring the peak height for the indicator reaction in the mixed solution of step (f); and (h) repeating steps (f) and (g) until the peak height has dropped to a constant value.

REFERENCES:
patent: 3808116 (1974-04-01), Webb
patent: 3838032 (1974-09-01), Yarnilsky
patent: 4142944 (1979-03-01), Smith
patent: 4182638 (1980-01-01), Cooke
patent: 4220515 (1980-09-01), deKreuk
patent: 4631116 (1986-12-01), Ludwig
"The Polarographic Analysis Of Tin And Tin Alloy Plating Solutions" by A. E. Knotowicz, et al., published by The Patent Button Company, Waterbury, Conn., (1989), pp. 602-606.
"Cyclic Voltammetric Stripping Analysis of Acid Copper Sulfate Plating Baths", by Ronald Haak, et al., (Apr. 1981) pp. 52-55.
"Cyclic Voltammetric Stripping Analysis Of Acid Copper Sulfate Plating Baths", by Ronald Haak, et al., (Mar. 1982) pp. 62-66.
"Determination Of The Individual Additive Components In Acid Copper Plating Baths" by Walter O. Freitag, et al., (Oct. 1983) pp. 55-60.
"Model 384B Polarographic Analyzer Instruction Manual" Published by Princeton Applied Research Corporation, Copyright 1983, 87, 88, pp. V-24-V-28.
"Monitoring Acid Copper Plating Baths", by S. Shawn Heberling et al., PC FAB, Aug. 1989, pp. 72-84.
"Electroplated Solder Joints For Flip-Chip Applications" by Edward K. Yung, IEEE Transactions On Components, Hybrids, And Manufacturing Technology, vol. 14, No. 3, Sep., 1991, pp. 549-559.

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