Method for analyzing effective polishing frequency and...

Details Method for analyzing effective polishing frequency and... Method for analyzing effective polishing frequency and...

2007-11-20

2007-11-20

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S164000

Reexamination Certificate

active

11286341

ABSTRACT:
A method for analyzing polishing frequency and number of polishing times for chemical planarization polishing wafer with different polishing pad profiles is disclosed. First, drawings of a wafer and a polishing pad are provided and then are converted into pixel arrays. Pixel arrays are processed to be black/white images. The black/white images are converted into binary matrices. The effective polishing frequencies of all points in the binary matrix are calculated. Following the calculated polishing frequencies, the coordinates of all binary matrices are redefined according to a displacement condition, and then new coordinates of all points and corresponding effective numbers of polishing times for a time increment are calculated so as to form an effective polishing times matrix for the time increment. Further, all effective numbers of polishing times within a total polishing time interval are added together.

REFERENCES:
patent: 6685543 (2004-02-01), Lai et al.

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