Method for analyzing copper electroplating solution,...

Details Method for analyzing copper electroplating solution,... Method for analyzing copper electroplating solution,...

2004-03-23

2010-10-26

Nguyen, Khiem D (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

C438S637000, C438S687000, C205S081000, C205S123000, C205S182000, C257SE21577, C257SE21585

Reexamination Certificate

active

07820535

ABSTRACT:
Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the fillability with the solution is judged from the curve profile. The time-dependent potential change curve within a predetermined period of time after the start of electrolysis is approximated according to the Boltzmann's function, and the potential change speed dx and the potential convergent point A2are obtained to judge the fillability with a plating solution.

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JP Pub. 05-080028 “Method for Analyzing Organic Additive in Electroplating Bath”, Sonnenberg et al. (Mar. 30, 1993), Machine English Translation.

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