Method for aligning wafer

Details Method for aligning wafer Method for aligning wafer

2006-10-17

2006-10-17

Lauchman, Layla G. (Department: 2877)

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

C356S400000

Reexamination Certificate

active

07123362

ABSTRACT:
A method for aligning wafer includes selecting a nun-defective wafer alignment mark of a first wafer loaded in an exposure apparatus, and storing non-defective wafer alignment marks as a gray level reference image. A plurality of wafer alignment marks of a loaded second wafer are stored. Each of the plurality of wafer alignment mark images of the second wafer are respectively compared with the reference image of the first wafer pixel by pixel to obtain matching value for each of the plurality of the wafer alignment mark images. Each of the plurality of values of the matching values are compared with a set minimum value. The wafer alignment mark image having the matching value smaller than the minimum value with the reference image is replaced. The alignment information for an underlying layer using a wafer alignment information for an underlying layer using a wafer alignment sensor is obtained.

REFERENCES:
patent: 5696835 (1997-12-01), Hennessey et al.
patent: 6481003 (2002-11-01), Maeda
patent: 2005/0009214 (2005-01-01), Lim et al.

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