Method for aligning the bondhead of a Die Bonder

Details Method for aligning the bondhead of a Die Bonder Method for aligning the bondhead of a Die Bonder

2006-06-27

2006-06-27

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

C156S064000, C700S121000

Reexamination Certificate

active

07066373

ABSTRACT:
In order to eliminate the inclination of a semiconductor chip picked by a gripper, the height of at least three points on the underneath of the semiconductor chip is determined in relation to a reference surface and from this the inclination is calculated. Determining the heights takes place in that the semiconductor chip is lowered until the semiconductor chip comes into contact with a needle.

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