Method for aligning substrates in a tray

Details Method for aligning substrates in a tray Method for aligning substrates in a tray

2005-03-29

2005-03-29

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S743000, C029S834000, C269S292000, C269S900000, C414S752100

Reexamination Certificate

active

06871394

ABSTRACT:
A substrate110that is not lying flat on its substrate tray100can present significant process problems when a vacuum pickup attempts to pick up the substrate and fails due to the lack of a proper bond forming between the pickup and the substrate110. The substrate110left behind on the substrate tray100could require human intervention. Intervention slows down the manufacturing process and increases costs. A method and apparatus to ensure that substrates are laying flat when presented to the vacuum pickup pad220is disclosed. A plate320with protrusions320is raised into a substrate tray100with holes. The protrusions320lift the substrates110up off the bottom of the substrate tray100and ensure that they are laying flat when presented to the vacuum pickup pad220.

REFERENCES:
patent: 4556362 (1985-12-01), Bahnck et al.
patent: 5966903 (1999-10-01), Dudderar et al.
patent: 6019564 (2000-02-01), Kiyokawa et al.
patent: 6135291 (2000-10-01), Canella

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