Method for aligning die to substrate

Details Method for aligning die to substrate Method for aligning die to substrate

2007-12-24

2010-12-07

Choi, William C (Department: 2873)

Optical: systems and elements

Optical modulator

Light wave temporal modulation

C359S198100, C257S678000

Reexamination Certificate

active

07848002

ABSTRACT:
A method for aligning a micro-mirror device die having a plurality of micro-mirror devices formed on a semiconductor substrate and fixing the micro-mirror device die on the semiconductor substrate can be provided. The method comprises a first alignment step of aligning a first guide portion of the micro-mirror device die and a second guide portion of the package substrate and a fixing step of fixing the micro-mirror device die on the package substrate in a position aligned by the first alignment step using the first and second guide portions.

REFERENCES:
patent: 5384940 (1995-01-01), Soule et al.
patent: 6028351 (2000-02-01), Klonis et al.
patent: 6392144 (2002-05-01), Filter et al.
patent: 6649435 (2003-11-01), Liu et al.
patent: 6825744 (2004-11-01), Harney
patent: 6947200 (2005-09-01), Huibers
patent: 2006/0270179 (2006-11-01), Yang

Affiliated with

Also associated with

Rating

Method for aligning die to substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for aligning die to substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for aligning die to substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4209027