Method for aligning devices

Details Method for aligning devices Method for aligning devices

2005-02-14

2008-09-23

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Thermally responsive

C438S613000, C438S612000, C438S116000, C438S114000

Reexamination Certificate

active

07427527

ABSTRACT:
A method is provided for aligning parts such as MEMS devices and photonics devices. One approach involves: providing between first and second parts a bonding material having fluid and solid states; applying a control field in the region of the bonding material, the bonding material changing its shape in direct response to changes in the control field while in the fluid state; adjusting the control field while the bonding material is in the fluid state so that the bonding material changes shape and causes relative movement of the first and second parts; and thereafter causing the bonding material to transition from the fluid state to the solid state while the first and second parts are in a selected position with respect to each other.

REFERENCES:
patent: 3663191 (1972-05-01), Kroder
patent: 4120758 (1978-10-01), Rippere
patent: 5986348 (1999-11-01), Fukano
patent: 6056844 (2000-05-01), Guiles et al.
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6346181 (2002-02-01), Lee et al.
patent: 6402923 (2002-06-01), Mayer et al.

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