Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1996-11-08
1999-03-16
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29829, H05K 0300
Patent
active
058824596
ABSTRACT:
A method and apparatus are provided for aligning and laminating stiffeners to substrates in electrical circuits. Generally, this method includes placing a substrate within an alignment frame or tool; applying an adhesive on the substrate; placing a stiffener on the adhesive to form a chip package; applying sufficient pressure and heat to the package for a sufficient time to cure the adhesive. Another method of the present invention includes placing a substrate within an alignment tool or frame; applying an adhesive on the substrate within the alignment tool; placing a stiffener on the adhesive to form a package; applying sufficient heat and pressure to the package for a sufficient time to tack the stiffener to the substrate; removing the package from the alignment tool or frame; and heating the package for a sufficient time and temperature to cure the adhesive wherein the stiffener enhances rigidity of the package.
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Petefish William George
Piper Boydd
Genco, Jr. Victor M.
Lorin Francis J.
W. L. Gore & Associates, Inc.
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