Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1997-11-24
2000-04-11
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438 15, 438108, H01L 2144
Patent
active
06048750&
ABSTRACT:
A method and apparatus for aligning and connecting objects, such as semiconductor components and substrates, are provided. The apparatus includes a hexapod with a moving platform for holding an object for movement in six degrees of freedom. The apparatus also includes a chuck assembly for holding a mating object in a stationary position. A camera and a height gauge are mounted on the moving platform to allow determination of the position and orientation of the object on the chuck assembly. Likewise, a camera and a height gauge are mounted on the chuck assembly to allow determination of the position and orientation of the object on the moving platform. The hexapod includes linear actuators operable by a controller upon signal input from the cameras and height gauges. The apparatus can be used to electrically connect semiconductor dice and chip scale packages to interconnects for testing. In addition, the apparatus can be used for bonding dice to substrates and leadframes, for probe testing semiconductor wafers, and for aligning and connecting spaced components, such as a baseplate and display screen of a field emission display.
REFERENCES:
patent: 4585991 (1986-04-01), Reid et al.
patent: 4899921 (1990-02-01), Bendat et al.
patent: 5124918 (1992-06-01), Beer et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5329423 (1994-07-01), Scholz
patent: 5483741 (1996-01-01), Akram et al.
patent: 5500605 (1996-03-01), Chang
patent: 5519332 (1996-05-01), Wood et al.
patent: 5539324 (1996-07-01), Wood et al.
patent: 5541525 (1996-07-01), Wood et al.
patent: 5547537 (1996-08-01), Reynolds
patent: 5604593 (1997-02-01), McMurtry
patent: 5634267 (1997-06-01), Farnworth et al.
patent: 5634585 (1997-06-01), Stansbury
patent: 5686317 (1997-11-01), Akram et al.
patent: 5739050 (1998-04-01), Farnworth
patent: 5869974 (1999-02-01), Akram et al.
patent: 5896036 (1999-04-01), Wood et al.
Baker, Stuart, "How Machine Design Affects Placement Precision", SMT, Nov. 1997, pp. 50-54.
O'Connor, Roy, "Inverted struts improve hexapod rigidity", Engineering News, date unknown.
"Hexel Corporation . . . Solutions", advertising brochure, Hexel Corporation, Sep. 1994.
"Sandia Hexapod Project", Sandia National Laboratories, visual media information, Mar. 15, 1996.
"Advanced Machine Tool Structures, The Shape of a New Machine", National Institute of Standards and Technology, visual media information, Jan. 13, 1997.
Storrs, John, "Distribution Notes for Hexapod-1.0", Laboratory for Micro Enterprise, pp. 1-3, Sep. 1996.
Gray, John E., "Parallel Link Mechanisms (PLM)", Jun. 1996.
Stewart Platform Automated Error Analysis, Ingersoll, pp. 1-2, Apr. 25, 1997.
Gratton Stephen A.
Micro)n Technology, Inc.
Picardat Kevin M.
LandOfFree
Method for aligning and connecting semiconductor components to s does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for aligning and connecting semiconductor components to s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for aligning and connecting semiconductor components to s will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1175898