Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1995-10-23
1997-06-03
Heinrich, Samuel M.
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
228177, 156 64, 445 24, H01J 188
Patent
active
056345852
ABSTRACT:
A method for aligning and bonding spaced components, such as a baseplate and a faceplate of a field emission display, is provided. The method includes: providing an optical alignment tool suitable for flip chip bonding; calibrating the tool to simulate a desired spacing in the assembled components; aligning the components using the calibrated tool; bringing the aligned components towards one another using the calibrated tool; and then bonding the components together with the desired spacing therebetween. The method of the invention can be practiced with an aligner bonder tool calibrated to eliminate a parallax error. A spacer element placed between the bondheads of the tool can be used to simulate the desired spacing during calibration. Alternately the spacing during calibration can be simulated by measuring with a caliper or other instrument.
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"Calibration of the M-8B", Operation Manual for Research Devices M-8B Aligner Bonder, 1990, pp. 1-12.
Gratton Stephen A.
Heinrich Samuel M.
Micron Display Technology Inc.
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