Method for aligning a semiconductor chip to be repaired with a r

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

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C01B 1100

Patent

active

054145198

ABSTRACT:
A method for aligning a semiconductor chip to be repaired with a repair system and a laser repair target used therefor, The laser repair target comprises at least one basic target adapted to be used in focusing, X-alignment and Y-alignment and shaped into a right-angled triangle and at least one bar type target adapted to be used in Theta-alignment. The laser repair target has selected targets at corners thereof, respectively. Offsets in X-direction and Y-direction are calculated on the basis of respective differences in X-coordinate and Y-coordinate between center X- and Y-coordinates and X- and Y-coordinates in actual scanning. It is possible to reduce the time required for the alignment of semiconductor chip to be repaired, thereby improving the productivity of semiconductor chips and reducing the total area of each semiconductor chip.

REFERENCES:
patent: 4385838 (1983-05-01), Nakazawa et al.
patent: 4575250 (1986-03-01), Suzuki
patent: 4856903 (1989-08-01), Kipphan et al.

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